数据搜索系统,热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

F2913 数据表(PDF) 2 Page - Renesas Technology Corp

部件名 F2913
功能描述  High Isolation SP2T RF Switch 50MHz to 6000MHz
PDF  18 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  RENESAS [Renesas Technology Corp]
网页  http://www.renesas.com
标志 RENESAS - Renesas Technology Corp

F2913 数据表(HTML) 2 Page - Renesas Technology Corp

  F2913 Datasheet HTML 1Page - Renesas Technology Corp F2913 Datasheet HTML 2Page - Renesas Technology Corp F2913 Datasheet HTML 3Page - Renesas Technology Corp F2913 Datasheet HTML 4Page - Renesas Technology Corp F2913 Datasheet HTML 5Page - Renesas Technology Corp F2913 Datasheet HTML 6Page - Renesas Technology Corp F2913 Datasheet HTML 7Page - Renesas Technology Corp F2913 Datasheet HTML 8Page - Renesas Technology Corp F2913 Datasheet HTML 9Page - Renesas Technology Corp Next Button
Zoom Inzoom in Zoom Outzoom out
 2 / 18 page
background image
F2913 Datasheet
© 2017–2023 Renesas Electronics Corporation
2
February 8, 2023
Pin Assignments
Figure 2. Pin Assignments for 4mm x 4mm x 0.95mm 20-QFN – Top View
F2913
GND
1
EP
2
3
4
5
11
12
13
14
15
6
7
8
9 10
20 19 18 17 16
RF1
GND
GND
GND
GND
RF2
GND
GND
GND
GND GND RFC GND GND
VDD GND GND C1 C2
Pin Descriptions
Table 1.
Pin Descriptions
Pin
Name
Function
1, 15, 18
GND
This pin is internally connected to the exposed paddle. Connect this pin to ground as close as possible to
the pin.
2, 4, 5, 6, 7,
9, 10, 11, 12,
14, 19
GND
Connect this pin directly to ground as close as possible to the pin with thru vias.
3
RF1
RF1 Port. If this pin is not 0V DC, then an external coupling capacitor must be used.
8
RFC
RF Common Port. If this pin is not 0V DC, then an external coupling capacitor must be used.
13
RF2
RF2 Port. If this pin is not 0V DC, then an external coupling capacitor must be used.
16
C2
Logic control pin. See Table 7 for proper logic setting.
17
C1
Logic control pin. See Table 7 for proper logic setting.
20
VDD
Power supply. Bypass to GND with capacitors shown in the Figure 30 as close as possible to the pin.
EP
Exposed Pad. This is internally connected to GND. Solder this exposed pad to a PCB pad that uses
multiple ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple
ground vias are also required to achieve the specified RF performance.



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18


数据表 下载

Go To PDF Page


链接网址



ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   数据表链接    |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com