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Version 7.1 – March 2025

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5

Physical Specification

5.1 Package Description

SHT4x is provided in an open-cavity dual flat no lead (DFN) package. The humidity sensor opening is

centered on the top side of the package. The sensor chip is made of silicon, hosted on a copper lead frame

and overmolded by an epoxy-based mold compound. Exposed bottom side of the leadframe with the

metallic contacts is Ni/Pd/Au coated, side walls are bare copper.

Moisture sensitivity level (MSL) of one according to IPC/JEDEC J-STD-020 is achieved. It is recommended to

process the sensors within one year after date of delivery.

5.2 Package Outline

Figure 15. Dimensional drawing of SHT4x including package tolerances (units mm).

Figure 16. Dimensional drawing of SHT4x with filter membrane including package tolerances (units mm)