Construction

A thin-film material is selectively deposited on an alumina substrate together with metallic contacts at each end of the

resistor. The unadjusted resistors are heat treated to give the required TCR and stability, then a precisely controlled laser

trim process adjusts the resistance value. Epoxy protection is applied, and wrap-around terminations are added and plated.

Each resistor is measured immediately before packing into tape.

Marking

APC resistors size 0603 and larger are marked white on black with 3 or 4 characters indicating ohmic value. APC0402 is not

marked.

Anti-Sulphur Precision Chip

APC Series

08.20

General Note

TT Electronics reserves the right to make changes in product specification without notice or liability.

All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.

© TT Electronics plc

www.ttelectronics.com/resistors

BI Technologies IRC Welwyn

Physical Data

Performance Data

Dimensions (mm) and weight (mg)

Size

L

W

C

A

T

Wt

0402

1 ±0.1

0.5 ±0.05

0.3 ±0.15

0.25 ±0.1

0.35 ±0.05

0.54

0603

1.55 ±0.1

0.8 ±0.1

0.3 ±0.2

0.3 ±0.2

0.45 ±0.1

1.8

0805

2 ±0.15

1.25 ±0.15

0.3 ±0.2

0.4 ±0.2

0.55 ±0.1

4.7

1206

3.05 ±0.15

1.55 ±0.15

0.42 ±0.2

0.35 ±0.25

0.55 ±0.1

9.0

1210

3.1 ±0.15

2.6 ±0.15

0.5 ±0.2

0.5 ±0.25

0.55 ±0.1

10

2010

4.9 ±0.15

2.5 ±0.15

0.6 ±0.3

0.6 ±0.25

0.55 ±0.1

24

2512

6.3 ±0.15

3.2 ±0.15

0.6 ±0.3

0.9 ±0.25

0.55 ±0.1

38

Test

Condition

SR Range

±ΔR%

AS Range (AEC-Q200) ±ΔR%

0.05% tol.

≥0.1% tol.

High Temperature Exposure MIL-STD-202 Method 108

0.3

0.2

Temperature Cycling

JESD22 Method JA-104

0.3

0.1

Biased Humidity

MIL-STD-202 Method 103

0.3

0.1

Operational Life

MIL-STD-202 Method 108

0.3

≤7K0: 0.05 >7K0: 0.2

0.2

High Power range: 0.5

Terminal Strength

MIL-STD202 Method 211

No Damage

No Damage

Resistance to Solvents

MIL-STD202 Method 215

Marking Legible

Marking Legible

Mechanical Shock

MIL-STD202 Method 213

0.25

0.05

0.1

Vibration

MIL-STD202 Method 204

0.1

0.05

0.1

Resistance to Soldering Heat MIL-STD-202 Method 210

0.2

0.05

ESD

AEC-Q200-002 or ISO/DIS

10605

-

0.5

Solderability

J-STD-002

>95% covered, no visible damage

>95% covered, no visible damage

Flammability

UL-94

-

No ignition

Board Flex

AEC Q200-005

0.1

0.1

Short Term Overload

2.5xRCWV for 5seconds

0.1

0.05

Sulphur Test

EIA-977 cond. B

750hrs, 105°C, no humidity

-

1

ASTM-B-809-95 modified

1000hrs, 105°C, 85% RH

4

-

T

W

A

A

L

Wrap-around terminations

(3 faces)

C