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STP16NF06 数据表(PDF) 3 Page - STMicroelectronics |
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STP16NF06 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 14 page ![]() STP16NF06 - STP16NF06FP Electrical ratings 3/14 1 Electrical ratings Table 1. Absolute maximum ratings Symbol Parameter Value Unit TO-220 TO-220FP VDS Drain-source voltage (VGS = 0) 60 V VGS Gate- source voltage ± 20 V ID Drain current (continuous) at TC = 25°C 16 11(1) 1. Current limited by package’s thermal resistance A ID Drain current (continuous) at TC = 100°C 11 7.5(1) A IDM (2) 2. Pulse width limited by safe operating area. Drain current (pulsed) 64 44(1) A Ptot Total dissipation at TC = 25°C 45 25 W Derating factor 0.3 0.17 W/°C dv/dt (3) 3. ISD ≤16A, di/dt ≤200A/µs, VDD ≤V(BR)DSS, Tj ≤TJMAX Peak diode recovery voltage slope 20 V/ns EAS (4) 4. Starting Tj = 25 °C, ID = 8A, VDD = 30V Single pulse avalanche energy 130 mJ IAR Avalanche current, repetitive or not- repetitive 16 A VISO Insulation withstand voltage (DC) -- 2500 V Tstg Storage temperature -55 to 175 °C Tj Max. operating junction temperature Table 2. Thermal data TO-220 TO-220FP Rthj-case Thermal resistance junction-case max 3.33 6 °C/W Rthj-amb Thermal resistance junction-ambient max 62.5 °C/W TJ Maximum lead temperature for soldering purpose 300 °C |
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