STTH4R02D datasheet(4/13 Pages) STMICROELECTRONICS

4 / 13 page

Characteristics

STTH4R02

4/13

Figure 3.

Forward voltage drop versus

forward current (maximum values)

Figure 4.

Relative variation of thermal

impedance, junction to case,

versus pulse duration (T0-220AC,

DPAK)

100

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

FM(A)

j=25°C

j=150°C

VFM(V)

0.1

1.0

1.E-03

1.E-02

1.E-01

1.E+00

th(j-c)/Rth(j-c)

Single pulse

TO-220AC

DPAK

tp(s)

Figure 5.

Relative variation of thermal

impedance, junction to case,

versus pulse duration

(TO-220FPAC)

Figure 6.

Relative variation of thermal

impedance, junction to ambient,

versus pulse duration (SMB)

0.0

0.1

1.0

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

th(j-c)/Rth(j-c)

Single pulse

TO-220FPAC

tp(s)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

th(j-a)/Rth(j-a)

SMB

Cu=1cm²

tp(s)

Figure 7.

Relative variation of thermal

impedance, junction to ambient,

versus pulse duration (DO-201AB)

Figure 8.

Relative variation of thermal

impedance, junction to ambient,

versus pulse duration (SMC)

100

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

th(j-a)(°C/W)

Single pulse

DO201AB

tp(s)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

th(j-a)/Rth(j-a)

SMC

Cu=1cm²

tp(s)

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