INA330

2

SBOS260

www.ti.com

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE-LEAD

DESIGNATOR(1)

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

INA330

MSOP-10

DGS

–40

°C to +85°C

TLB

INA330AIDGST

Tape and Reel, 250

"

"""

"

INA330AIDGSR

Tape and Reel, 2500

NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.

PACKAGE/ORDERING INFORMATION

ABSOLUTE MAXIMUM RATINGS(1)

Supply Voltage .................................................................................. +5.5V

Signal Input Terminals:

(Pins 1, 2, 3, 6, and 10) Voltage(2) ......................... –0.5V to (V+) + 0.5V

Current(2) ...............................................

±10mA

Output Short-Circuit(3) .............................................................. Continuous

Operating Temperature Range ....................................... –40

°C to +125°C

Storage Temperature Range .......................................... –65

°C to +150°C

Junction Temperature .................................................................... +150

°C

Lead Temperature (soldering, 10s) ............................................... +300

°C

NOTES: (1) Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods may degrade

device reliability. These are stress ratings only, and functional operation of the

device at these or any other conditions beyond those specified is not implied.

(2) Input terminals are diode clamped to the power-supply rails. Input signals that

can swing more than 0.5V beyond the supply rails should be current limited to

10mA or less. (3) Short-circuit to ground.

Top View

MSOP

PIN CONFIGURATION

1

2

3

4

5

10

9

8

7

6

I

1 (RTHERM)

V+

V

O

I

O (RG)

Enable

I

2 (RSET)

V

2

V

1

GND

(Connect to V+)

INA330

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instru-

ments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.