Bottom View

12 Pin 3mm x 3mm WSON Package

DQB0012A

Die-Attach

Pad (DAP)

GND

2

3

4

5

1

6

11

10

9

8

12

7

Die-Attach

Pad (DAP)

GND

2

3

4

5

1

6

11

10

9

8

12

7

Top View

LM3553

SNVS414B – FEBRUARY 2008 – REVISED MAY 2013

www.ti.com

Connection Diagram

PIN DESCRIPTIONS

Pin

Name

Function

4

VIN

Input Voltage. Input range: 2.7V to 5.5V.

5

SW

Switch Pin

6

OVP

Over Voltage Protection Pin

2, 11

D1, D2

Regulated current sink inputs

DAP

GND

Ground

1

ISET

Current sense input. Connect a 1% 16.5k

Ω resistor to ground to set the full scale LED current.

3

FEN

Flash enable pin.

8

SCL

Serial clock pin.

10

SDA

Serial data I/O pin.

9

VIO

Digital Reference Voltage level input pin.

7

TX

RF PA synchronization control pin. High = Forced Torch mode.

12

M/F

Hardware RESET or General purpose I/O. Function set through Multi-Function Control Register

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2) (3)

VIN pin: Voltage to GND

-0.3V to 6V

SW, OVP pin: Voltage to GND

-0.3V to 25V

D1, D2 pins: Voltage to GND

-0.3V to 25V

VIO, SCL, SDA

-0.3V to 6V

TX, FEN, M/F

-0.3V to 6V

Continuous Power Dissipation (4)

Internally Limited

Junction Temperature (TJ-MAX )

150°C

Storage Temperature Range

-65°C to +150

Maximum Lead Temperature (Soldering)

(5)

ESD Rating(6)

Human Body Model

2.5kV

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is specified. Operating Ratings do not imply performance limits. For performance limits and associated test

conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=140ºC (typ.) and

disengages at TJ=120ºC (typ.).

(5)

For detailed soldering specifications and information, please refer to Texas Instruments Application Note: AN-1187 SNOA401 for

Recommended Soldering Profiles.

(6)

The human body model is a 100pF capacitor discharged through a 1.5k

Ω resistor into each pin. (MIL-STD-883 3015.7)

2

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