www.nxp.com/iMX8Mplus

NNXP, the NXP logo, EdgeVerse, eIQ and immersiv3D are trademarks of NXP B.V. All other product or service names are the property of their respective owners. OpenCL and the OpenCL logo are

trademarks of Apple Inc. used by permission by Khronos. OpenGL® and the oval logo are trademarks or registered trademarks of Hewlett Packard Enterprise in the United States and/or other countries

worldwide. OpenVG and the OpenVG logo are trademarks of the Khronos Group Inc. Vulkan and the Vulkan logo are registered trademarks of the Khronos Group Inc. Arm, Cortex, Neon and

TrustZone are trademarks or registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere. The related technology may be protected by any or all patents, copyrights, designs

and trade secrets. All rights reserved. © 2021 NXP B.V.

Document Number: IMX8MPLUSFS REV 4

COMPREHENSIVE SOFTWARE

SUPPORT

NXP supports Android™, Linux® and

FreeRTOS commercial operating

systems. NXP also offers the eIQ™

software tookit, a collection of

libraries and development tools for

building machine learning applications

targeting NXP i.MX applications

processors and MCUs. The eIQ toolkit

leverages open-source technologies

and is fully integrated into NXP’s Yocto

development environments, allowing

the development of complete system-

level applications with ease.

HARDWARE TOOLS

The i.MX 8M Plus evaluation kit

(EVK) enables SoC evaluation and

system prototyping.

Multiple accessory boards are available

to facilitate i.MX 8M Plus processor

evaluation for applications such as

camera modules and display panels.

EXPERT PACKAGE DESIGN FOR

SIMPLIFIED SYSTEM DESIGN

NXP engineers have defined package

options that simplify hardware design

and provide overall system cost benefits

depending on the application. Reference

hardware designs are available to help

get customers started fast.

INDUSTRIAL AND CONSUMER

QUALIFIED

An industrial temperature range (-40

ºC to 105 ºC Tj) supports always-on

operation for more than 10 years. A

consumer application temperature

range (0 ºC to 95 ºC Tj) presents

higher processing frequency.

SUPPLY LONGEVITY

NXP’s Product Longevity program

ensures supply continuity and preserves

your engineering investment for

embedded designs for 10 to 15 years.

https://www.nxp.com/products/

product-information/product-

longevity:PRDCT_ LONGEVITY_HM

i.MX 8M PLUS FEATURES AND BENEFITS

CAPABILITY

FEATURE

BENEFITS

Machine

Learning

Machine

Learning

Neural processing unit (NPU) up to 2.3 TOPS

• Edge inference and intelligence

• No cloud dependency, privacy, better user experience

Vision System

Up to 2 x camera (2 x MIPI-CSI), up to 4Kp30

• 4K vision/1080p stereo vision

• HDR extracts the maximum image details in high-contrast scenes

Dual Camera ISP (2 x HD/1x 12MP) HDR, dewarp

• Dewarp: Fisheye lens correction, reduction of overall optical system

cost

Voice

Low-power voice accelerator,

8-ch. PDM digital microphone input

• Voice systems processed at the edge

• Privacy, better user experience, no cloud dependency

• Low noise and cost-effective microphone system

Advanced

Multimedia

HD Video

1080p60 video decoding, (H.265, H.264)

1080p60 video encoding, (H.265, H.264)

• High-resolution video compression for cloud upload or local storage

• Effective compression with H.265, about twice as effective than H.264

3D/2D

Graphics

OpenVG™ 1.1, OpenGL® ES 3.1, Vulkan®,

OpenCL™ 1.2 FP

• 3D and 2D graphics for rich HMI and user experience

• Vulkan support for Android™ 10 onwards

Advanced

Audio

18 x I2S TDM, DSD512, SP/DIF Tx + Rx, 8-ch. PDM

HDMI 2.0b Tx + eARC, ASRC

• Latest audio technology, including Immersiv3D™ audio software

• eARC for high quality audio for cost-optimized soundbars

Industrial

Network and

Reliability

Industrial

Network

2 x Gigabit Ethernet (1 x with TSN), 2 x CAN FD

• Low latency industrial network for precise control and Industry 4.0

support

• Robust local industrial control network

• Gateway application with dual Ethernet

Memory

Reliability

ECC on L2-cache, In-line ECC on DDR bus

14 nm FinFET process

• High industrial system reliability for safety industrial level

• Low SER rates

Real-Time

Processing

Arm® Cortex®-M7 @ 800 MHz

• High real-time processing power

• Cortex-A complex off loading

• Potential for eliminating an external MCU

Performance

and

Connectivity

High

Performance,

Low Power

2 x or 4 x Cortex-A53 @ 1.8 GHz,

14 nm FinFET, low power, high performance

• Up to 21,600 DMIPS

• Applications running < 2.0 W deep sleep mode < 20 mW

Display

Interfaces

MIPI-DSI, HDMI 2.0b, LVDS 4/8-lane; supports up to

2x1080p60 or 1x4kp30

• Multiple display interface options capable to operate simultaneously

High-Speed

Interfaces

2 x USB 2.0/3.0 (5 Gbit/s each), PCIe® 3.0 (8 Gbit/s),

3 x SDIO 3.0 800 Mbit/s

• Fast connections to Wi-Fi®, FPGAs, coprocessors

• Fast data transfer, e.g., media files