4 Specifications

4.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply-voltage

-0.5

6

V

IIK

Input diode current

(VI < -0.5 V or VI >

VCC + 0.5 V)

±20

mA

IOk

Output diode current

(Vo < -0.5 V or Vo >

VCC + 0.5 V)

±50

mA

IO

Output source or sink current per output pin

(VO > -0.5 V or VO <

VCC ± 0.5 V)

±50

mA

VCC or ground current (ICC or IGND)

±100

mA(2)

Tstg

Storage temperature

-65

+150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

For up to 4 outputs per device; add ± 25 mA for each additional output.

4.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

4.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)

CHARACTERISTIC

MIN

MAX

UNIT

VCC (2)

Supply-voltage range: (For TA = full package-temperature range)

AC types

1.5

5.5

V

ACT types

4.5

5.5

V

VI, VO

Input or output voltage

0

VCC

V

TA

Operating temperature

-55

+ 125

°C

dt/dv

Input rise and fall slew rate

at 1.5 V to 3 V (AC types)

0

50

ns/V

at 3.6 V to 5.5 V (AC types)

0

20

ns/V

at 4.5 V to 5.5 V (ACT types)

0

10

ns/V

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application

report: Implications of Slow or FLoating CMOS Inputs.

(2)

Unless otherwise specified, all voltages are referenced to ground.

4.4 Thermal Information

THERMAL METRIC(1)

CDx4AC/ACT574

UNIT

DW (SOIC)

N (PDIP)

20 PINS

20 PINS

RθJA

Junction-to-ambient thermal resistance

101.2

50

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

CD54AC574, CD74AC574, CD54ACT574, CD74ACT574

SCHS292A – DECEMBER 1998 – REVISED MAY 2024

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