0.05 MIN

ALL AROUND

0.05 MAX

ALL AROUND

4222980/A

05/2016

SOLDER MASK

OPENING

METAL

NON-SOLDER MASK

DEFINED

METAL UNDER

SOLDER MASK

SOLDER MASK

OPENING

SOLDER MASK

DEFINED

0.05 MIN

ALL AROUND

4X (1.14)

4X (0.32)

3X (0.65)

2X (1.66)

4X (0.32)

4X (0.4)

(1.28)

(R0.05) TYP

2X (0.65)

(1.28)

(0.415)

(1.195)

(0.04) TYP

(1.2) TYP

(

0.2) TYP

(0.805)

2X (0.62)

PKG

PKG

SYMM

METAL UNDER

SOLDER MASK

TYP

SOLDER MASK

OPENING

TYP

1

4

5

8

SEE DETAILS

10

CSD87313DMS

SLPS642 – APRIL 2017

www.ti.com

Product Folder Links: CSD87313DMS

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Copyright © 2017, Texas Instruments Incorporated

7.2 Recommended PCB Pattern

(1)

This package is designed to be soldered to a thermal pad on the board. For more information, see QFN/SON PCB

Attachment (SLUA271).

(2)

Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their

locations shown on this view. It is recommended that vias under paste be filled, plugged or tented.