REG113

11

SBVS031D

www.ti.com

FIGURE 7. Thermal Resistance versus PCB Area for the MSOP-8.

THERMAL RESISTANCE vs PCB COPPER AREA

160

150

140

130

120

110

100

90

80

70

60

012345

Power dissipation depends on input voltage, load condi-

tions, and duty cycle and is equal to the product of the

average output current times the voltage across the output

PV

V

I

DIN

OUT

OUT

=•

(

–

)

(3)

Power dissipation can be minimized by using the lowest possible

input voltage necessary to assure the required output voltage.