LMP7721

SNOSAW6E – JANUARY 2008 – REVISED DECEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

VIN Differential

–0.3

0.3

V

Supply Voltage (VS = V

+ – V−) (3)

–0.3

6.0

V

Voltage on Input/Output Pins

V+ + 0.3

V−

− 0.3

V

Junction Temperature (4)

150

°C

Soldering Information

Infrared or Convection (20 sec)

235

°C

Wave Soldering Lead Temp. (10 sec)

260

°C

Storage temperature, Tstg

−65

150

°C

(1)

Absolute Maximum Ratings(1)(2) indicate limits beyond which damage to the device may occur. Recommended Operating Conditions

indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications

and the test conditions, see the Electrical Characteristics Tables.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

The voltage on any pin should not exceed 6V relative to any other pins.

(4)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) - TA)/θJA. All numbers apply for packages soldered directly onto a PC Board.

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V(ESD)

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±200

C101(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

Temperature Range(1)

–40

125

°C

Supply Voltage (VS = V

+ – V−):

0°C

≤ TA ≤ 125°C

1.8

5.5

V

−40°C ≤ TA ≤ 125°C

2.0

5.5

V

(1)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) - TA)/θJA. All numbers apply for packages soldered directly onto a PC Board.

6.4 Thermal Information

LMP7721

THERMAL METRIC(1)

D

UNIT

8 PINS

RθJA

Junction-to-ambient thermal resistance

190

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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