-

4

+OUT

5

-OUT

3

6

V+

V-

EN

2

7

VOCM

+

1

8

-IN

+IN

LMP8350

www.ti.com

SNOSB80C – FEBRUARY 2011 – REVISED OCTOBER 2015

5 Pin Configuration and Functions

D Package

8-Pin SOIC

Top View

Pin Functions

PIN

I/O

DESCRIPTION

NO.

NAME

1

–IN

I

Inverting Input

Output common-mode voltage set input. Sets output common mode voltage equal to the

2

VOCM

I

applied VOCM pin voltage.

3

V+

I

Positive power supply voltage

4

+OUT

O

Noninverting output

5

–OUT

O

Inverting output

6

V–

I

Negative power supply voltage

7

EN

I

Enable and power select input. Applied voltage sets power level or shutdown mode.

8

+IN

I

Noninverting Input

6 Specifications

6.1 Absolute Maximum Ratings

(1) (2) (3)

MIN

MAX

UNIT

Output short circuit duration

See (4)

V+ relative to V–

–0.3

12.9

V

IN+, IN–, OUT, EN and VOCM pins

(V+) + 0.3

(V–) – 0.3

V

Input current

1

mA

Junction temperature(5)

150

°C

Storage temperature, Tstg

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3)

For soldering specifications: SNOA549

(4)

The short circuit test is a momentary test which applies to both single-supply and split-supply operation. Continuous short circuit

operation at elevated ambient temperature can exceed the maximum allowable junction temperature of 150°C. Positive number (+) is

sourcing, negative number (–) is sinking.

(5)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.

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