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EXAMPLE STENCIL DESIGN

(5.4)

12X (1.27)

14X (0.6)

14X (1.55)

4220718/A 09/2016

SOIC - 1.75 mm max height

D0014A

SMALL OUTLINE INTEGRATED CIRCUIT

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

9. Board assembly site may have different recommendations for stencil design.

SYMM

SYMM

1

7

8

14

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:8X