4

LP2983

SNVS170D – OCTOBER 2001 – REVISED APRIL 2016

www.ti.com

Product Folder Links: LP2983

Submit Documentation Feedback

Copyright © 2001–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If used in a dual-supply system where the regulator load is returned to a negative supply, the LP2983 output must be diode-clamped to

ground.

(3)

The output PNP structure contains a diode between the IN and OUT pins that is normally reverse-biased. Reversing the polarity from

VIN to VOUT turn on this diode (See Reverse Input-Output Voltage).

(4)

The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal

resistance, RθJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated

using P(MAX) = (TJ(MAX) – TA) / RθJA. The value of RθJA for the SOT-23 package varies depending on the application board — the value

given inThermal Information can be considered as the worstcase scenario. Exceeding the maximum allowable power dissipation causes

excessive die temperature, and the regulator will go into thermal shutdown.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input supply voltage (survival)

−0.3

16

V

Input supply voltage (operating)

2.3

16

V

Shutdown input voltage (survival)

−0.3

16

V

Output voltage (survival)(2)

−0.3

9

V

IOUT (survival)

Short-circuit protected

Input-output voltage (survival)(3)

−0.3

16

V

Operating junction temperature

−40

125

°C

Power dissipation(4)

Internally limited

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (all pins

except pin 3)(1)

±2000

V

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (pin 3) (1)

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Operating junction temperature

−40

125

°C

Input supply voltage (operating)

2.2

16

V

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

Thermal resistance value RθJA is based on the EIA/JEDEC High-K printed circuit board defined by: JESD51-7 - High Effective Thermal

Conductivity Test Board for Leaded Surface Mount Packages.

6.4 Thermal Information

THERMAL METRIC(1)

LP2983

UNIT

DBV (SOT-23)

5 PINS

RθJA

Junction-to-ambient thermal resistance, High-K(2)

169.0

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

121.8

°C/W

RθJB

Junction-to-board thermal resistance

29.5

°C/W

ψJT

Junction-to-top characterization parameter

16.1

°C/W

ψJB

Junction-to-board characterization parameter

29.0

°C/W