LP3918

SNVS476D – AUGUST 2007 – REVISED MAY 2013

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Thermal Properties

(1)

Junction to Ambient Thermal Resistance

θJA

Jedec Standard Thermal PCB

37°C/W

4L Cellphone Board

66°C/W

(1)

Junction-to-ambient thermal resistance (

θJA) is taken from thermal modelling result, performed under the conditions and guidelines set

forth in the JEDEC standard JESD51-7. The value of (

θJA) of this product could fall within a wide range, depending on PWB material,

layout, and environmental conditions. In applications where high maximum power dissipation exists (high VIN, high IOUT), special care

must be paid to thermal dissipation issues in board design.

6

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