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LP55281TL/NOPB 数据表(PDF) 2 Page - Texas Instruments |
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LP55281TL/NOPB 数据表(HTML) 2 Page - Texas Instruments |
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2 / 42 page ![]() 2 LP55281 SNVS458D – JUNE 2007 – REVISED OCTOBER 2016 www.ti.com Product Folder Links: LP55281 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Table of Contents 1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Pin Configuration and Functions ......................... 3 6 Specifications......................................................... 5 6.1 Absolute Maximum Ratings ...................................... 5 6.2 ESD Ratings.............................................................. 5 6.3 Recommended Operating Conditions ....................... 5 6.4 Thermal Information .................................................. 6 6.5 Electrical Characteristics........................................... 6 6.6 SPI Timing Requirements ......................................... 9 6.7 I2C Timing Requirements ....................................... 10 6.8 Boost Converter Typical Characteristics................. 11 6.9 RGB Driver Typical Characteristics ........................ 12 7 Detailed Description ............................................ 13 7.1 Overview ................................................................. 13 7.2 Functional Block Diagram ....................................... 14 7.3 Feature Description................................................. 15 7.4 Device Functional Modes........................................ 23 7.5 Programming........................................................... 25 7.6 Register Maps ......................................................... 30 8 Application and Implementation ........................ 31 8.1 Application Information............................................ 31 8.2 Typical Application ................................................. 31 8.3 Initialization Set Up Example .................................. 34 9 Power Supply Recommendations ...................... 34 10 Layout................................................................... 35 10.1 Layout Guidelines ................................................. 35 10.2 Layout Example .................................................... 36 11 Device and Documentation Support ................. 37 11.1 Device Support...................................................... 37 11.2 Related Documentation ....................................... 37 11.3 Receiving Notification of Documentation Updates 37 11.4 Community Resources.......................................... 37 11.5 Trademarks ........................................................... 37 11.6 Electrostatic Discharge Caution ............................ 37 11.7 Glossary ................................................................ 37 12 Mechanical, Packaging, and Orderable Information ........................................................... 37 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (March 2013) to Revision D Page • Added Device Information and Pin Configuration and Functions sections, ESD Ratings and Thermal Information tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections; update title............................................................................................................................................ 1 • Added NRST pin connection to MCU on Simplified Schematic ............................................................................................ 1 • Changed RθJA for YPG package from "60°C/W" to "48.9°C/W"and for YZR package from "60°C/W" to "49.1°C/W"............ 6 Changes from Revision B (March 2013) to Revision C Page • Changed layout of National Semiconductor data sheet to TI format...................................................................................... 1 |
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