PTH08080W

SLTS235D – FEBRUARY 2005 – REVISED SEPTEMBER 2013

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION

For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see

the TI website at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted

(1)

PTH08080W

UNIT

TA

Operating free-air

Over VI range

–40 to 85

°C

temperature

Wave Solder

Suffix AH

235

temperature

Suffix AD

260

TS

Surface temperature of module body or pins

°C

Solder reflow

Suffix AS

235

temperature

Suffix AZ

260

Tstg Storage temperature

–55 to 125

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

RECOMMENDED OPERATING CONDITIONS

MIN

MAX

UNIT

VI

Input voltage

4.5

18

V

TA

Operating free-air temperature

–40

85

°C

PACKAGE SPECIFICATIONS

PTH08080W (Suffix AH and AS)

Weight

1.5 grams

Flammability

Meets UL 94 V-O

Mechanical shock

Per Mil-STD-883D, Method 2002.3, 1 ms, 1/2 sine, mounted

500 G (1)

Mechanical vibration

Mil-STD-883D, Method 2007.2, 20-2000 Hz

20 G (1)

(1)

Qualification limit.

2

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