Bourns Part No.

Inductance

Q typ.

Test Freq.

SRF MHz

DCR

I rms

nH

Tol. %

(@ 100 MHz)

L MHz

min.

mohm max. mA max.

CE201210-1N5D

1.5

± 0.3 nH

21

100

4000

100

300

CE201210-1N8D

1.8

± 0.3 nH

18

100

4000

100

300

CE201210-2N2D

2.2

± 0.3 nH

18

100

4000

100

300

CE201210-2N7D

2.7

± 0.3 nH

19

100

4000

100

300

CE201210-3N3J

3.3

± 5

16

100

4000

130

300

CE201210-3N9J

3.9

± 5

18

100

4000

150

300

CE201210-4N7J

4.7

± 5

18

100

3500

200

300

CE201210-5N6J

5.6

± 5

20

100

3200

230

300

CE201210-6N8J

6.8

± 5

20

100

2800

250

300

CE201210-8N2J

8.2

± 5

21

100

2400

280

300

CE201210-10NJ

10

± 5

20

100

2100

300

300

CE201210-12NJ

12

± 5

21

100

1900

350

300

CE201210-15NJ

15

± 5

22

100

1600

400

300

CE201210-18NJ

18

± 5

24

100

1500

450

300

CE201210-22NJ

22

± 5

23

100

1400

500

300

CE201210-27NJ

27

± 5

23

100

1300

550

300

CE201210-33NJ

33

± 5

24

100

1200

600

300

CE201210-39NJ

39

± 5

23

100

1000

650

300

CE201210-47NJ

47

± 5

23

100

900

700

300

CE201210-56NJ

56

± 5

23

100

800

750

300

CE201210-68NJ

68

± 5

25

100

700

800

300

CE201210-82NJ

82

± 5

24

100

600

900

300

CE201210-R10J

100

± 5

23

100

600

900

300

CE201210-R12J

120

± 5

22

50

500

950

300

CE201210-R15J

150

± 5

22

50

500

1000

300

CE201210-R18J

180

± 5

23

50

400

1100

300

CE201210-R22J

220

± 5

20

50

350

1200

300

CE201210-R27J

270

± 5

20

50

300

1300

300

CE201210-R33J

330

± 5

22

50

250

1400

300

CE201210-R39J

390

± 5

17

50

250

1300

300

CE201210-R47J

470

± 5

17

50

200

1500

300

9.0

(.354)

12.0

(.472)

2.0 ± 0.8

(.079 ± .031)

60.0

(2.362)

178.0

(7.00)

DIA.

13.5 ± 0.5

(.531 ± .020)

DIA.

13.0 ± 0.5

(.512 ± .020)

DIA.

21.0 ± 0.8

(.827 ± .031)

Packaging Specifications

CE201210 Series - Multi-Layer Chip Inductors

Features

■

0805 size

■

Available in E12 Series

■

High frequency

■

Nickel barrier

■

Lead free

Applications

■

Mobil phones

■

Cellular phones

■

CTV, VCR, HIC, FDD

■

Automotive electronics

Electrical Specifications

Product Dimensions

Recommended Layout

2.0 ± 0.2

(.079 ± .008)

A ± 0.20

(A ± 0.008)

0.5 ± 0.3

(0.02 ± 0.008)

1.0 ± 0.2

(.039 ± 0.08)

General Specifications

Temperature Rise

...................30 ˚C max. at rated current

Operating Temperature .-55 °C to +125 °C

Storage Temperature..-55 °C to +125 °C

Reflow Soldering ...230 °C, 50 sec. max.

Resistance to Soldering Heat

...............................260 ˚C, 10 seconds

Materials

Base Material .............................Ceramic

Terminal.....................................Ag/Ni/Sn

Packaging:

0.85 mm product height

................................4,000 pcs. per reel

1.00 mm product height

................................4,000 pcs. per reel

1.25 mm product height

................................2,000 pcs. per reel

1.0

(.039)

1.0

(.039)

3.0

(.118)

DIMENSIONS:

MM

(INCHES)

Model

Dimension A

CE201210-1N5D through

CE201210-82NJ

CE201210-R10J through

CE201210-R39J

CE201210-R47J

0.85

(0.033)

1.00

(0.039)

1.25

(0.050)

*RoHS Directive 2002/95/EC Jan 27 2003 including Annex

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.