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STM32F412RGU3P 数据表(PDF) 168 Page - STMicroelectronics |
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STM32F412RGU3P 数据表(HTML) 168 Page - STMicroelectronics |
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168 / 201 page  Package information STM32F412xE/G 168/201 DocID028087 Rev 7 Figure 61. WLCSP64 - 64-pin, 3.658 x 3.686 mm, 0.4 mm pitch wafer level chip scale recommended footprint Table 99. WLCSP64 - 64-pin, 3.658 x 3.686 mm, 0.4 mm pitch wafer level chip scale package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Min Typ Max A 0.525 0.555 0.585 0.0207 0.0219 0.0230 A1 - 0.170 - - 0.0067 - A2 - 0.380 - - 0.0150 - A3(2) 2. Back side coating. - 0.025 - - 0.0010 - b(3) 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 0.220 0.250 0.280 0.0087 0.0098 0.0110 D 3.588 3.623 3.658 0.1413 0.1426 0.1440 E 3.616 3.651 3.686 0.1424 0.1437 0.1451 e - 0.400 - - 0.0157 - e1 - 2.800 - - 0.1102 - e2 - 2.800 - - 0.1102 - F - 0.4115 - - 0.0162 - G - 0.4255 - - 0.0168 - aaa - - 0.100 - - 0.0039 bbb - - 0.100 - - 0.0039 ccc - - 0.100 - - 0.0039 ddd - - 0.050 - - 0.0020 eee - - 0.050 - - 0.0020 |
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