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STM32F412RGU3P 数据表(PDF) 170 Page - STMicroelectronics

部件名 STM32F412RGU3P
功能描述  Arm®-Cortex®-M4 32b MCUFPU, 125 DMIPS, 1MB Flash, 256KB RAM, USB OTG FS, 17 TIMs, 1 ADC, 17 comm. interfaces
PDF  201 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STM32F412RGU3P 数据表(HTML) 170 Page - STMicroelectronics

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Package information
STM32F412xE/G
170/201
DocID028087 Rev 7
7.2
UFQFPN48 package information
Figure 63. UFQFPN48 - 48-lead, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat
package outline
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and
solder this back-side pad to PCB ground.
Table 101. UFQFPN48 - 48-lead, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat
package mechanical data
Symbol
millimeters
inches(1)
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.500
0.550
0.600
0.0197
0.0217
0.0236
A1
0.000
0.020
0.050
0.0000
0.0008
0.0020
D
6.900
7.000
7.100
0.2717
0.2756
0.2795
E
6.900
7.000
7.100
0.2717
0.2756
0.2795
D2
5.500
5.600
5.700
0.2165
0.2205
0.2244



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