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DW OR NS PACKAGE

(TOP VIEW)

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11

1OE

1A1

2Y4

1A2

2Y3

1A3

2Y2

1A4

2Y1

GND

VCC

2OE

1Y1

2A4

1Y2

2A3

1Y3

2A2

1Y4

2A1

DESCRIPTION/ORDERING INFORMATION

SN74ACT244-EP

OCTAL BUFFER/DRIVER

WITH 3-STATE OUTPUTS

SCAS724B – OCTOBER 2003 – REVISED MARCH 2006

•

Controlled Baseline

– One Assembly/Test Site, One Fabrication

Site

•

Extended Temperature Performance of up to

–55

°C to 125°C

•

Enhanced Diminishing Manufacturing

Sources (DMS) Support

•

Enhanced Product-Change Notification

•

Qualification Pedigree (1)

•

4.5-V to 5.5-V V

CC Operation

•

Inputs Accept Voltages to 5.5 V

•

Max t

pd of 9.5 ns at 5 V

•

Inputs Are TTL Compatible

(1)

Component qualification in accordance with JEDEC and

industry standards to ensure reliable operation over an

extended temperature range. This includes, but is not limited

to, Highly Accelerated Stress Test (HAST) or biased 85/85,

temperature cycle, autoclave or unbiased HAST,

electromigration, bond intermetallic life, and mold compound

life. Such qualification testing should not be viewed as

justifying use of this component beyond specified

performance and environmental limits.

The SN74ACT244-EP octal buffer/driver is designed specifically to improve the performance and density of

3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

The device is organized as two 4-bit buffers/drivers with separate output-enable (OE) inputs. When OE is low,

the device passes noninverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the

high-impedance state.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup

resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

ORDERING INFORMATION

TA

PACKAGE(1)

ORDERABLE PART NUMBER

TOP-SIDE MARKING

SOIC – DW

Tape and reel

SN74ACT244MDWREP

SACT244MEP

–55

°C to 125°C

SOP – NS

Tape and reel

SN74ACT244MNSREP

SACT244MEP

–40

°C to 85°C

SOIC – DW

Tape and reel

SN74ACT244IDWREP

SACT244IEP

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

FUNCTION TABLE

(EACH BUFFER)

INPUTS

OUTPUT

Y

OE

A

L

H

H

L

L

L

H

X

Z

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2003–2006, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.