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STM32F427NET6XXX 数据表(PDF) 11 Page - STMicroelectronics

部件名 STM32F427NET6XXX
功能描述  ARM Cortex-M4 32b MCUFPU, 225DMIPS, up to 2MB Flash/2564KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 20 comm. interfaces, camera & LCD-TFT
PDF  231 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STM32F427NET6XXX 数据表(HTML) 11 Page - STMicroelectronics

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STM32F427xx STM32F429xx
List of figures
11
Figure 91.
LQFP176 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205
Figure 92.
LQFP208 - 208-pin, 28 x 28 mm low-profile quad flat package outline . . . . . . . . . . . . . . 206
Figure 93.
LQFP208 - 208-pin, 28 x 28 mm low-profile quad flat package
recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208
Figure 94.
LQFP208 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209
Figure 95.
UFBGA169 - 169-ball 7 x 7 mm 0.50 mm pitch, ultra fine pitch ball grid array
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
Figure 96.
UFBGA169 - 169-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch
ball grid array recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211
Figure 97.
UFBGA169 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212
Figure 98.
UFBGA176+25 - 201-ball 10 x 10 mm, 0.65 mm pitch ultra thin fine pitch
ball grid array package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213
Figure 99.
UFBGA176+25 - 201-ball, 10 x 10 mm, 0.65 mm pitch, ultra fine pitch ball
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . grid array package recommended footprint214
Figure 100. UFBGA176+25 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . 215
Figure 101. TFBGA216 - 216 ball 13 × 13 mm 0.8 mm pitch thin fine pitch ball grid array
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216
Figure 102. TFBGA176 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217
Figure 103. USB controller configured as peripheral-only and used
in Full speed mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221
Figure 104. USB controller configured as host-only and used in full speed mode. . . . . . . . . . . . . . . . 221
Figure 105. USB controller configured in dual mode and used in full speed mode . . . . . . . . . . . . . . . 222
Figure 106. USB controller configured as peripheral, host, or dual-mode
and used in high speed mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223
Figure 107. MII mode using a 25 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224
Figure 108. RMII with a 50 MHz oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224
Figure 109. RMII with a 25 MHz crystal and PHY with PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225



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