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STM32F427NET7 数据表(PDF) 217 Page - STMicroelectronics |
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STM32F427NET7 数据表(HTML) 217 Page - STMicroelectronics |
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217 / 231 page  DocID024030 Rev 6 217/231 STM32F427xx STM32F429xx Package information 225 Device marking for TFBGA176 The following figure gives an example of topside marking orientation versus ball A1 identifier location. Figure 102. TFBGA176 marking example (package top view) 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering Samples to run qualification activity. F - 0.900 - - 0.0354 - ddd - - 0.080 - - 0.0031 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 120. TFBGA216 - 216 ball 13 × 13 mm 0.8 mm pitch thin fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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