TLC354

LinCMOS

™ QUADRUPLE DIFFERENTIAL COMPARATORS

SLCS116B – SEPTEMBER 1985 – REVISED FEBRUARY 1997

3

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

TLC364Y chip information

This chip, when properly assembled, displays characteristics similar to the TLC354C. Thermal compression or

ultrasonic bonding can be used on the doped-aluminum bonding pads. Chips can be mounted with conductive

epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJMAX = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

PIN (4) IS INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

+

–

3OUT

3 IN +

3IN –

VDD – /GND

(10)

(9)

(8)

(11)

(14)

–

+

(13)

4IN +

4IN –

4OUT

(12)

+

–

VDD

(3)

(4)

(7)

(6)

(5)

(1)

–

+

(2)

65

90

1IN +

1IN –

2OUT

1OUT

2IN +

2IN –

(12)

(13)

(14)

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)

(9)

(10)

(11)