PIC12LF1501 datasheet(265/352 Pages) MICROCHIP

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DS40001607D-page 265

PIC16(L)F1503

28.0

ELECTRICAL SPECIFICATIONS

28.1

Absolute Maximum Ratings(†)

Ambient temperature under bias...................................................................................................... -40°C to +125°C

Storage temperature ........................................................................................................................ -65°C to +150°C

Voltage on pins with respect to VSS

on VDD pin

PIC16F1503 .............................................................................................................. -0.3V to +6.5V

PIC16LF1503 ............................................................................................................ -0.3V to +4.0V

on MCLR pin ........................................................................................................................... -0.3V to +9.0V

on all other pins ............................................................................................................ -0.3V to (VDD + 0.3V)

Maximum current

on VSS pin(1)

-40°C

 TA  +85°C .............................................................................................................. 250 mA

+85°C

 TA  +125°C ............................................................................................................. 85 mA

on VDD pin(1)

-40°C

 TA  +85°C .............................................................................................................. 250 mA

+85°C

 TA  +125°C ............................................................................................................. 85 mA

Sunk by any standard I/O pin ............................................................................................................... 50 mA

Sourced by any standard I/O pin .......................................................................................................... 50 mA

Clamp current, IK (VPIN < 0 or VPIN > VDD) ...................................................................................................

20 mA

Total power dissipation(2) ............................................................................................................................... 800 mW

Note 1:

Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be

limited by the device package power dissipation characterizations, see Table 28-6 to calculate device

specifications.

Power dissipation is calculated as follows: PDIS = VDD x {IDD –

 IOH} +  {(VDD – VOH) x IOH} + (VOl x IOL).

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for

extended periods may affect device reliability.

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