TMP100, TMP101

SBOS231I – JANUARY 2002 – REVISED NOVEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Power supply, V+

7.5

V

Input voltage(2)

–0.5

7.5

V

Operating temperature

–55

125

°C

Junction temperature, TJ

150

°C

Storage temperature, Tstg

–60

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input voltage rating applies to all TMP100 and TMP101 input voltages.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V(ESD)

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101(2)

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

2.7

5.5

V

Operating free-air temperature, TA

–55

125

°C

6.4 Thermal Information

TMP100, TMP101

THERMAL METRIC(1)

DBV (SOT-23)

UNIT

6 PINS

RθJA

Junction-to-ambient thermal resistance

182.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

115

°C/W

RθJB

Junction-to-board thermal resistance

30.2

°C/W

ψJT

Junction-to-top characterization parameter

17.1

°C/W

ψJB

Junction-to-board characterization parameter

29.7

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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