TPS731

SBVS034N – SEPTEMBER 2003 – REVISED DECEMBER 2015

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Table of Contents

1

Features .................................................................. 1

8

Application and Implementation ........................ 14

8.1

Application Information............................................ 14

2

Applications ........................................................... 1

8.2

Typical Applications ................................................ 14

3

Description ............................................................. 1

9

Power Supply Recommendations ...................... 17

4

Revision History..................................................... 2

10

Layout................................................................... 17

5

Pin Configuration and Functions ......................... 3

10.1

Layout Guidelines ................................................. 17

6

Specifications......................................................... 4

10.2

Layout Example .................................................... 17

6.1

Absolute Maximum Ratings ...................................... 4

10.3

Thermal Considerations ........................................ 17

6.2

ESD Ratings ............................................................ 4

11

Device and Documentation Support ................. 19

6.3

Recommended Operating Conditions ....................... 4

11.1

Device Support...................................................... 19

6.4

Thermal Information .................................................. 4

11.2

Documentation Support ....................................... 19

6.5

Electrical Characteristics........................................... 5

11.3

Related Links ........................................................ 19

6.6

Typical Characteristics .............................................. 6

11.4

Community Resources.......................................... 20

7

Detailed Description ............................................ 11

11.5

Trademarks ........................................................... 20

7.1

Overview ................................................................. 11

11.6

Electrostatic Discharge Caution ............................ 20

7.2

Functional Block Diagrams ..................................... 11

11.7

Glossary ................................................................ 20

7.3

Feature Description................................................. 12

12

Mechanical, Packaging, and Orderable

7.4

Device Functional Modes........................................ 13

Information ........................................................... 20

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision M (August 2009) to Revision N

Page

•

Changed first and third Features bullets ................................................................................................................................ 1

•

Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section ................................................................................................. 1

•

Changed list of recommended Applications ........................................................................................................................... 1

•

Changed Pin Configuration and Functions section; updated table format to meet new standards ...................................... 3

•

Changed free-air temperature to junction temperature in Absolute Maximum Ratings condition statement ........................ 4

•

Deleted Power Dissipation Ratings table ............................................................................................................................... 4

•

Changed Thermal Information table; updated thermal resistance values for all packages .................................................. 4

Changes from Revision L (May, 2009) to Revision M

Page

•

Changed Figure 10 ................................................................................................................................................................ 6

•

Added paragraph about recommended start-up sequence to Internal Current Limit section .............................................. 13

•

Added paragraph about current foldback and device start-up to Enable Pin and Shutdown section .................................. 13

2

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