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BUF04701 数据表(PDF) 2 Page - Texas Instruments |
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BUF04701 数据表(HTML) 2 Page - Texas Instruments |
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2 / 30 page ![]() BUF07703 BUF06703 BUF05703 SBOS269C – MARCH 2003 – REVISED APRIL 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE INFORMATION(1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING BUF07703 HTSSOP-20 PWP BUF07703 BUF06703 TSSOP −16 PW BUF06703 BUF05703 TSSOP −14 PW BUF05703 (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted). BUFxx703 UNIT Supply, VDD (2) 16.5 16.5 Input Voltage Range, VI VDD V Continuous Total Power Dissipation See Dissipation Ratings Table Operating Free −Air Temperature Range, TA –40 to +85 °C Maximum Junction Temperature, TJ +150 °C Storage Temperature Range, TSTG −65 to +150 °C (1) Stresses above these ratings may cause permanent damage. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to GND. DISSIPATION RATINGS qJC qJA TA ≤ +25°C PACKAGE TYPE PACKAGE DESIGNATOR (°C/W) (°C/W) POWER RATING TSSOP −20 PowerPAD PWP (20) 1.40(1) 32.63(1) 3.83W(1) TSSOP −16 PW (16) — 108 1.15W TSSOP −14 PW (14) — 112 1.11W (1) Thermal specifications assume 2oz. trace and copper pad with solder. RECOMMENDED OPERATING CONDITIONS Over operating free-air temperature range (unless otherwise noted). MIN NOM MAX UNIT Supply Voltage, VDD 4.5 16 V Operating Free-Air Temperature, TA –40 +85 °C TSSOP-20 PowerPAD +125 °C Junction Temperature TSSOP-16, 14 +150 °C 2 Copyright © 2003–2010, Texas Instruments Incorporated Product Folder Link(s): BUF07703 BUF06703 BUF05703 |
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