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STTH1R02A 数据表(PDF) 5 Page - STMicroelectronics

部件名 STTH1R02A
功能描述  Ultrafast recovery diode
PDF  10 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STTH1R02A 数据表(HTML) 5 Page - STMicroelectronics

  STTH1R02A Datasheet HTML 1Page - STMicroelectronics STTH1R02A Datasheet HTML 2Page - STMicroelectronics STTH1R02A Datasheet HTML 3Page - STMicroelectronics STTH1R02A Datasheet HTML 4Page - STMicroelectronics STTH1R02A Datasheet HTML 5Page - STMicroelectronics STTH1R02A Datasheet HTML 6Page - STMicroelectronics STTH1R02A Datasheet HTML 7Page - STMicroelectronics STTH1R02A Datasheet HTML 8Page - STMicroelectronics STTH1R02A Datasheet HTML 9Page - STMicroelectronics Next Button
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STTH1R02
Characteristics
5/10
Figure 11.
Peak reverse recovery curent
versus dIF/dt (typical values)
Figure 12.
Dynamic parameters versus
junction temperature
0
1
2
3
4
5
6
7
8
10
100
1000
I
RM(A)
I
F=1.5A
V
R=160V
T
j=125°C
T
j=25°C
dIF/dt(A/µs)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
25
50
75
100
125
150
Q
RR;IRM [Tj]/ QRR;IRM [Tj=125°C]
I
RM
Q
RR
I
F=1.5A
V
R=160V
Tj(°C)
Figure 13.
Thermal resistance, junction to
ambient, versus copper surface
under each lead - SMA (Epoxy FR4,
copper thickness = 35 µm)
Figure 14.
Thermal resistance, junction to
ambient, versus copper surface
under each lead - SMB (Epoxy FR4,
copper thickness = 35 µm)
0
20
40
60
80
100
120
0
1
23
45
R
th(j-a) (°C/W)
SMA
SCU(cm²)
0
10
20
30
40
50
60
70
80
90
100
110
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
R
th(j-a)(°C/W)
SMB
SCU(cm²)
Figure 15.
Thermal resistance, junction to
ambient, versus copper surface
under each lead - DO 15 (Epoxy
FR4, copper thickness = 35 µm)
Figure 16.
Thermal resistance, junction to
ambient, versus copper surface
under each lead - DO-41 (Epoxy
FR4, copper thickness = 35 µm)
0
10
20
30
40
50
60
70
80
90
100
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
R
th(j-a) (°C/W)
DO-15
SCU(cm²)
0
10
20
30
40
50
60
70
80
90
100
01
23
456
78
9
10
R
th(j-a)(°C/W)
DO-41
S(cm²)



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