UCC2912

UCC3912

PROGRAMMABLE HOT SWAP POWER MANAGER

SLUS241D − MARCH 1994 - REVISED NOVEMBER 2003

2

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description (continued)

The UCC3912 family is designed for unidirectional current flow, emulating an ideal diode in series with the power

switch. This feature is particularly attractive in applications where many devices are powering a common bus,

such as with SCSI Termpwr.

The UCC3912 family can be put into sleep mode drawing only 1-

µA of supply current. The SHTDWN pin has

a preset threshold hysteresis which allows the user the ability to set a time delay upon startup to achieve

sequencing of power. Other features include an open drain FAULT output indicator, thermal shutdown, under

voltage lockout, and a low thermal resistance small outline package.

absolute maximum ratings over operating free-air temperature (unless otherwise noted)†}

VIN

8 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

FAULT sink current

50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

FAULT voltage

-0.3 to VIN

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output current

Self Limiting

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage

(B0, B1, B2, B3, IMAX, SHTDWN)

-0.3 to VIN

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature range, Tstg

-65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operating junction temperature range, TJ

-55

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature (soldering, 10 sec.)

300

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

‡ Currents are positive into, negative out of the specified terminal. Consult Packaging Section of the Interface Products Data book (TI Literature

Number SLUD002) for thermal limitations and considerations of packages.

package information

DIL-16, SOIC-16

N, DP Package

(TOP VIEW)

TSSOP-24,

PWP Package

(TOP VIEW)

*Pin 5 serves as lowest impedance to the electrical

ground; Pins 4, 12, and 13 serve as heat sink/ground.

These pins should be connected to large etch areas to

help dissipate heat. For N package, pins 4, 12, and 13

are N/C.

*Pin 9 serves as lowest impedance to the electrical ground;

other GND pins serve as heat sink/ground. These pins should

be connected to large etch areas to help dissipate heat.

B3

VOUT

GND*

GND*

FAULT

N/C

EGND*

GND*

GND*

VIN

VIN

GND*

SHTDWN

GND*

B2

GND*

GND*

CT

12

11

10

9

8

7

6

5

4

3

2

1

13

14

15

16

17

18

19

20

21

22

23

24

IMAX

N/C

VOUT

B1

B0

GND*