7

TUSB9261

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SLLSE67I – MARCH 2011 – REVISED MARCH 2016

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted)

MIN

MAX

UNIT

VDD

Steady-state supply voltage

–0.3

1.4

V

VDD33/

VDDA33

Steady-state supply voltage

–0.3

3.8

V

Tstg

Storage temperature

–55

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

VESD

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS001(1)

±2000

V

Charged device model (CDM), per JESD22-C101(2)

±1500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD

Digital 1.1-V supply voltage

1.045

1.1

1.155

V

VDD33

Digital 3.3-V supply voltage

3

3.3

3.6

V

VDDA33

Analog 3.3-V supply voltage

3

3.3

3.6

V

VBUS

Voltage at VBUS PAD

0

1.155

V

TA

Operating free-air temperature range

0

70

°C

Industrial version

–40

85

TJ

Operating junction temperature range

–40

100

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1)

TUSB9261

UNIT

PVP (HTQFP)

64 PINS

RθJA

Junction-to-ambient thermal resistance

30.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

11.0

°C/W

RθJB

Junction-to-board thermal resistance

6.1

°C/W

ψJT

Junction-to-top characterization parameter

0.4

°C/W

ψJB

Junction-to-board characterization parameter

6.1

°C/W

RJθC(bot)

Junction-to-case (bottom) thermal resistance

0.9

°C/W