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PFS7523L 数据表(PDF) 17 Page - Power Integrations, Inc. |
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PFS7523L 数据表(HTML) 17 Page - Power Integrations, Inc. |
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17 / 37 page ![]() Rev. D 04/25 17 PFS7523-7529/7533-7539 www.power.com Figure 16. Heat Sink Assembly – using Thermally Conductive Adhesive. 1 5 3 4 2 (2X) 2. Screw 1. Heat Sink 4. HiperPFS-3 3. Thermally Conductive Adhesive 5. Eyelet Terminal − Electrical Connection to Heat Sink The value of resistor R5 will have to be adjusted in some designs and as a guideline the value from the following calculation can be used: P O Maximum continuous output power in watts. V O Nominal PFC output voltage in volts. C O PFC output capacitance in farads. Heat Sinking and Thermal Design Figures 15, 16, 17 show an example of the recommended assembly for the HiperPFS-3. In this assembly, no insulation pad is required and HiperPFS-3 can be directly connected to the heat sink by mechanical clip or adhesive thermal compound. The HiperPFS-3 back metal is electrically connected to the heat sink and the heat sink is required to be connected to the HiperPFS-3 source terminal in order to reduce EMI. |
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