6 Detailed Description

6.1 Overview

The ESDS304, ESDS302 devices are uni-directional ESD Protection Diode with ultra-low capacitance. This

device can dissipate ESD strikes above the maximum level specified by the IEC 61000-4-2 International

Standard. The ultra-low capacitance makes this device an excellent choice for protecting any super high-speed

signal pins.

6.2 Functional Block Diagram

6.3 Feature Description

The I/O pins of ESDS304 and ESDS302 can withstand surge events (IEC 61000-4-5, 8/20μs waveform) up to

12A and 85 W. These devices also provide ESD protection up to ±30kV contact and ±30kV air gap per IEC

61000-4-2 standard. The I/O pins can withstand an electrical fast transient burst of up to 80 A (IEC 61000-4-4

5/50ns waveform, 4kV with 50Ω impedance). The capacitance between each I/O pin to ground is 2.3pF (typical)

and 2.8pF (maximum). This device supports data rates up to 1-Gbps. The reverse DC breakdown voltage of

each I/O pin is a minimum of 4.5V. This design protects sensitive equipment from surges above the reverse

standoff voltage of 3.6V. The I/O pins feature an ultra-low leakage current of 50nA (maximum) with a bias of

3.6V. This device features an industrial operating range of –40°C to +125°C.

6.4 Device Functional Modes

The ESDS304, ESDS302 devices are a passive integrated circuit that triggers when voltages are above VBRF or

below 0.7V. During ESD events, voltages as high as ±30kV (air) can be directed to ground via the internal diode

network. When the voltages on the protected line fall below the trigger levels of ESDS304, ESDS302 (usually

within a few nano-seconds) the devices reverts to passive.

ESDS302, ESDS304

SLVSEG8B – MAY 2018 – REVISED JANUARY 2024

www.ti.com

8

Submit Document Feedback

Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: ESDS302 ESDS304