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STM32L412R8I6P 数据表(PDF) 167 Page - STMicroelectronics |
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STM32L412R8I6P 数据表(HTML) 167 Page - STMicroelectronics |
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167 / 192 page ![]() DS12469 Rev 4 167/192 STM32L412xx Package information 189 production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. 7.2 UFBGA64 package information Figure 40. UFBGA – 64 balls, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid array package outline 1. Drawing is not to scale. Table 95. UFBGA – 64 balls, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid array package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.460 0.530 0.600 0.0181 0.0209 0.0236 A1 0.050 0.080 0.110 0.0020 0.0031 0.0043 A2 0.400 0.450 0.500 0.0157 0.0177 0.0197 A3 0.080 0.130 0.180 0.0031 0.0051 0.0071 A4 0.270 0.320 0.370 0.0106 0.0126 0.0146 b 0.170 0.280 0.330 0.0067 0.0110 0.0130 D 4.850 5.000 5.150 0.1909 0.1969 0.2028 D1 3.450 3.500 3.550 0.1358 0.1378 0.1398 E 4.850 5.000 5.150 0.1909 0.1969 0.2028 E1 3.450 3.500 3.550 0.1358 0.1378 0.1398 |
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