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STM32L412R8I6P 数据表(PDF) 179 Page - STMicroelectronics |
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STM32L412R8I6P 数据表(HTML) 179 Page - STMicroelectronics |
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179 / 192 page  DS12469 Rev 4 179/192 STM32L412xx Package information 189 Figure 50. WLCSP - 36 balls, 2.58 x 3.07 mm, 0.4 mm pitch, wafer level chip scale recommended footprint 1. Dimensions are expressed in millimeters. Device marking The following figure gives an example of topside marking orientation versus ball 1 identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Table 100. WLCSP36 recommended PCB design rules Dimension Recommended values Pitch 0.4 mm Dpad 0,225 mm Dsm 0.290 mm typ. (depends on soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm |
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