LMH1981

SNLS214H – APRIL 2006 – REVISED MARCH 2013

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PIN DESCRIPTIONS

Pin No.

Pin Name

Pin Description

1

REXT

Bias Current External Resistor

2, 5, 10

GND

Ground

3, 6, 11

VCC

Supply Voltage

4

VIN

Video Input

7

HSOUT

Horizontal Sync Output

8

VSOUT

Vertical Sync Output

9

VFOUT

Video Format Output

12

CSOUT

Composite Sync Output

13

BPOUT

Burst/Back Porch Timing Output

14

OEOUT

Odd/Even Field Output

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2) (3)

ESD Tolerance (4)

Human Body Model

3.5 kV

Machine Model

350V

Charge-Device Model

1.0 kV

Supply Voltage, VCC

0V to 5.5V

Video Input, VIN

−0.3V to VCC + 0.3V

Storage Temperature Range

−65°C to +150°C

Lead Temperature (soldering 10 sec.)

300°C

Junction Temperature (TJMAX)

(5)

+150°C

Thermal Resistance (

θJA)

52°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics Tables.

(2)

All voltages are measured with respect to GND, unless otherwise specified.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(5)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) - TA)/θJA . All numbers apply for packages soldered directly onto a PC board.

Operating Ratings

(1)

Temperature Range (2)

−40°C to +85°C

VCC

3.3V

−5% to 5V +5%

Input Amplitude, VIN-AMPL

140 mV to VCC–VIN-CLAMP

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics Tables.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) - TA)/θJA . All numbers apply for packages soldered directly onto a PC board.

2

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