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STM32L412RBT3TR 数据表(PDF) 177 Page - STMicroelectronics |
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STM32L412RBT3TR 数据表(HTML) 177 Page - STMicroelectronics |
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177 / 192 page ![]() DS12469 Rev 4 177/192 STM32L412xx Package information 189 7.5 WLCSP36 package information Figure 49. WLCSP - 36 balls, 2.58 x 3.07 mm, 0.4 mm pitch, wafer level chip scale package outline 1. Drawing is not to scale. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. |
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