BAS70J / BAS70W / BAS70-04W /

BAS70-05W / BAS70-06W

3/5

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

1E-4

1E-3

1E-2

7E-2

VFM(V)

IFM(A)

Tj=100

°C

Typical values

Tj=25

°C

Maximum values

Tj=25

°C

Typical values

Fig. 1: Forward voltage drop versus forward

current.

0

5 10 15 20 25 30 35 40 45 50 55 60 65 70

1E-3

1E-2

1E-1

1E+0

1E+1

VR(V)

IR(

µA)

Tj=25

°C

Tj=100

°C

Fig. 2: Reverse leakage current versus reverse

voltage applied (typical values).

0

25

50

75

100

125

150

1E-2

1E-1

1E+0

1E+1

1E+2

5E+2

Tj(

°C)

IR(

µA)

VR=70V

Fig. 3: Reverse leakage current versus junction

temperature (typical values).

1

10

100

0.1

1.0

2.0

VR(V)

C(pF)

F=1MHz

Tj=25

°C

Fig. 4: Junction capacitance versus reverse

voltage applied (typical values).

1E-3

1E-2

1E-1

1E+0

1E+1

1E+2

0.01

0.10

1.00

tp(s)

Zth(j-a)/Rth(j-a)

Single pulse

δ = 0.1

δ = 0.2

δ = 0.5

T

tp

Fig. 5: Relative variation of thermal impedance

junction to ambient versus pulse duration (epoxy

FR4

with

recommended

pad

layout,

S(Cu)=35

µm).

0

5

10

15

20

25

30

35

40

45

50

300

350

400

450

500

550

600

S(Cu) (mm )

Rth(j-a) (

°C/W)

P=0.2W

Fig. 6: Thermal resistance junction to ambient

versus copper surface under each lead (Epoxy

printed circuit board FR4, copper thickness:

35

µm).