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LP5523

SNVS550E – SEPTEMBER 2009 – REVISED JANUARY 2017

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Copyright © 2009–2017, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ...................................... 4

6.2

ESD Ratings.............................................................. 4

6.3

Recommended Operating Conditions ....................... 4

6.4

Thermal Information .................................................. 5

6.5

Electrical Characteristics........................................... 5

6.6

Charge Pump Electrical Characteristics .................. 6

6.7

LED Driver Electrical Characteristics ........................ 6

6.8

LED Test Electrical Characteristics .......................... 6

6.9

Logic Interface Characteristics ................................. 7

6.10

Recommended External Clock Source Conditions . 7

6.11

Serial Bus Timing Parameters (SDA, SCL) ............ 8

6.12

Typical Characteristics ............................................ 9

7

Detailed Description ............................................ 11

7.1

Overview ................................................................. 11

7.2

Functional Block Diagram ....................................... 11

7.3

Feature Description................................................. 12

7.4

Device Functional Modes........................................ 17

7.5

Programming........................................................... 19

7.6

Register Maps ......................................................... 22

8

Application and Implementation ........................ 49

8.1

Application Information............................................ 49

8.2

Typical Applications ................................................ 49

9

Power Supply Recommendations ...................... 53

10

Layout................................................................... 54

10.1

Layout Guidelines ................................................. 54

10.2

Layout Example .................................................... 54

11

Device and Documentation Support ................. 55

11.1

Device Support .................................................... 55

11.2

Receiving Notification of Documentation Updates 55

11.3

Community Resources.......................................... 55

11.4

Trademarks ........................................................... 55

11.5

Electrostatic Discharge Caution ............................ 55

11.6

Glossary ................................................................ 55

12

Mechanical, Packaging, and Orderable

Information ........................................................... 55

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision D (May 2013) to Revision E

Page

•

Changed title of data sheet for SEO ..................................................................................................................................... 1

•

Added Device Information and Pin Configuration and Functions sections, ESD Ratings and Thermal Information

tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply

Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable

Information sections................................................................................................................................................................ 1

•

Changed RθJA value from "87°C/W" to "60.9°C/W" ................................................................................................................ 5

•

Added values in the Thermal Information table to align with JEDEC standards. .................................................................. 5

Changes from Revision C (April 2013) to Revision D

Page

•

Changed layout of National Semiconductor data sheet to TI format.................................................................................... 53