4 Pin Configuration and Functions

1

2

3

NC

SOT23

GND

V

O

Figure 4-1. DBZ Package 3-Pin SOT-23 Top View

Table 4-1. Pin Functions

PIN

I/O

DESCRIPTION

NAME

NO.

Vo

1

I/O

Shunt Current/Voltage input

GND

2

O

Ground connection

NC

3

-

Must float or connect to GND

5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Reverse breakdown current

10

mA

Forward current

10

mA

Operating temperature

–55

125

°C

Junction temperature

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated

under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods can affect device

reliability.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

IREF

Reverse current

0.0012

5

mA

TA

Operating temperature

–40

125

°C

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REF1112

SBOS283E – SEPTEMBER 2003 – REVISED DECEMBER 2024

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