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STA1050 数据表(PDF) 9 Page - STMicroelectronics |
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STA1050 数据表(HTML) 9 Page - STMicroelectronics |
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9 / 11 page ![]() STA1050 Package information 9/11 4 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 3. LQFP128 (14x14x1.4mm) Mechanical Data & Package Dimensions OUTLINE AND MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 1.600 0.063 A1 0.050 0.150 0.002 0.006 A2 1.350 1.400 1.450 0.053 0.055 0.057 b 0.130 0.180 0.230 0.005 0.007 0.009 c 0.090 0.200 0.003 0.008 D 15.800 16.000 16.200 0.622 0.630 0.638 D1 13.800 14.000 14.200 0.543 0.551 0.559 D3 12.400 0.488 e 0.400 0.016 E 15.800 16.000 16.200 0.622 0.630 0.638 E1 13.800 14.000 14.200 0.543 0.551 0.559 E3 12.400 0.488 L 0.450 0.600 0.750 0.018 0.024 0.030 L1 1.000 0.0393 K 0˚ (min.), 3.5˚ (typ.), 7˚(max.) ccc 0.080 0.003 LQFP128 (14 x 14 x 1.40mm) 7111275 B |
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