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STLC2690 数据表(PDF) 4 Page - STMicroelectronics

部件名 STLC2690
功能描述  Bluetooth V2.1 and FM RDS transceiver system-on-chip
PDF  6 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STLC2690 数据表(HTML) 4 Page - STMicroelectronics

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Overview
STLC2690
4/6
1.3
Description
The STLC2690 is a system-on-chip Bluetooth V2.1 + EDR transceiver and FM R(B)DS
transceiver designed in ST low-power 65 nm RFCMOS process. The chip is offered in a
Wafer Level Chip Scale Package (WLCSP) of 0.6 mm height and 0.4 mm pitch.
The Bluetooth part is ROM-based, for applications requiring integration up to HCI level.
Patch RAM is available, enabling multiple patches/upgrades and fast time to volume. The
main interfaces are UART, SPI or SDIO for HCI transport, PCM or I2S for voice and a WLAN
coexistence interface. The radio has been designed specifically for single chip requirements,
for low power and minimum BOM count.
The FM radio transceiver contains both a broadcast FM radio tuner and a FM transmitter for
portable applications with worldwide FM band support. (De)multiplexing and (de)modulation
are performed in a digital data path. A small embedded microcontroller manages the
flexibility of the data path and takes care of the overall control of the transceiver. This
microcontroller is also used for transmission and reception of the European Radio Data
System (RDS) and the North American Radio Broadcast Data System (RBDS), including all
required symbol decoding, block synchronization, error detection, and error correction
functions. The FM can be controlled by the Host via a dedicated I2C interface or via the
Bluetooth HCI interface. A Host-level API is offered in order to facilitate integration of the FM
driver on the Host. Also a low-level API is supported.
The Bluetooth transceiver and FM transceiver are integrated on the same silicon, and share
at top-level power supplies, clocks and reset control. The chip integrates several regulators
to generate the internally needed voltages from the Host platform supply input.
The low external BOM count results in an overall PCB footprint of less than 36 mm2 (using
0201 components where possible, with a 0.3 mm spacing rule). The FM antenna matching
network, which depends on the specific antenna implementation, is included in this footprint.



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