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SN74LVC2G66

SCES325N – JULY 2001 – REVISED AUGUST 2018

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Copyright © 2001–2018, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ..................................... 4

6.2

ESD Ratings.............................................................. 4

6.3

Recommended Operating Conditions ....................... 4

6.4

Thermal Information .................................................. 5

6.5

Electrical Characteristics........................................... 5

6.6

Switching Characteristics ......................................... 6

6.7

Analog Switch Characteristics .................................. 6

6.8

Operating Characteristics.......................................... 7

6.9

Typical Characteristics .............................................. 7

7

Parameter Measurement Information .................. 8

8

Detailed Description ............................................ 13

8.1

Overview ................................................................. 13

8.2

Functional Block Diagram ....................................... 13

8.3

Feature Description................................................. 13

8.4

Device Functional Modes........................................ 13

9

Application and Implementation ........................ 14

9.1

Application Information............................................ 14

9.2

Typical Application ................................................. 14

10

Power Supply Recommendations ..................... 15

11

Layout................................................................... 16

11.1

Layout Guidelines ................................................. 16

11.2

Layout Example .................................................... 16

12

Device and Documentation Support ................. 17

12.1

Community Resources.......................................... 17

12.2

Trademarks ........................................................... 17

12.3

Electrostatic Discharge Caution ............................ 17

12.4

Glossary ................................................................ 17

13

Mechanical, Packaging, and Orderable

Information ........................................................... 17

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision M (May 2018) to Revision N

Page

•

Changed the YZP pin configuration ...................................................................................................................................... 3

Changes from Revision L (September 2015) to Revision M

Page

•

Updated pinout image and the Pin Function table ................................................................................................................ 3

•

Changed pin 3 Name From: 1C To: 2C ................................................................................................................................ 3

•

Changed the Thermal Information table for the DCT package .............................................................................................. 5

Changes from Revision K (January 2014) to Revision L

Page

•

Added Applications section, Device Information table, Pin Configuration and Functions section, ESD Ratings table,

Typical Characteristics section, Feature Description section, Device Functional Modes, Application and

Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation

Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1

•

Added Thermal Information table ........................................................................................................................................... 5

Changes from Revision J (December 2011) to Revision K

Page

•

Updated document to new TI data sheet format--no specification changes. ......................................................................... 1

•

Removed Ordering Information table. .................................................................................................................................... 1