TL331-EP

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SLVSBU6 – JUNE 2013

THERMAL INFORMATION

TL331-EP

THERMAL METRIC(1)

DBV

UNITS

5 PINS

θJA

Junction-to-ambient thermal resistance(2)

299

θJCtop

Junction-to-case (top) thermal resistance(3)

65.4

θJB

Junction-to-board thermal resistance(4)

97.1

°C/W

ψJT

Junction-to-top characterization parameter(5)

0.8

ψJB

Junction-to-board characterization parameter(6)

95.5

θJCbot

Junction-to-case (bottom) thermal resistance(7)

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3)

The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(5)

The junction-to-top characterization parameter,

ψJT, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining

θJA, using a procedure described in JESD51-2a (sections 6 and 7).

(6)

The junction-to-board characterization parameter,

ψJB, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining

θJA , using a procedure described in JESD51-2a (sections 6 and 7).

(7)

The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific

JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

Spacer

ELECTRICAL CHARACTERISTICS

at specified free-air temperature, VCC = 5 V (unless otherwise noted)

PARAMETER

TEST CONDITIONS(1)

TA

MIN

TYP

MAX

UNIT

25°C

2

5

VCC = 5 V to 30 V, VO = 1.4 V,

VIO

Input offset voltage

mV

VIC = VIC(min)

–55°C to 125°C

9

25°C

5

50

IIO

Input offset current

VO = 1.4 V

nA

–55°C to 125°C

250

25°C

–25

–250

IIB

Input bias current

VO = 1.4 V

nA

–55°C to 125°C

–400

0 to

25°C

VCC – 1.5

Common-mode input voltage

VICR

V

range(2)

0 to

–55°C to 125°C

VCC – 2

Large-signal differential-voltage

VCC = 15 V, VO = 1.4 V to 11.4 V,

AVD

25°C

50

200

V/mV

amplification

RL ≥ 15 kΩ to VCC

VOH = 5 V, VID = 1 V

25°C

0.1

50

nA

IOH

High-level output current

VOH = 30 V, VID = 1 V

–55°C to 125°C

1

μA

25°C

150

400

VOL

Low-level output voltage

IOL = 4 mA, VID = –1 V

mV

–55°C to 125°C

700

IOL

Low-level output current

VOL = 1.5 V, VID = –1 V

25°C

6

mA

ICC

Supply current

RL = ∞, VCC = 5 V

25°C

0.4

0.7

mA

(1)

All characteristics are measured with zero common-mode input voltage, unless otherwise specified.

(2)

The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-

mode voltage range is VCC+ – 1.5 V, but either or both inputs can go to 30 V without damage.

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