TLV2221, TLV2221Y

Advanced LinCMOS RAILTORAIL

VERY LOW POWER SINGLE OPERATIONAL AMPLIFIERS

SLOS157B − JUNE1996 − REVISED APRIL 2005

3−2

WWW.TI.COM

AVAILABLE OPTIONS

TA

VIOmax AT 25°C

PACKAGED DEVICES

SYMBOL

CHIP

FORM‡

TA

VIOmax AT 25°C

SOT-23 (DBV)†

SYMBOL

FORM‡

(Y)

0

°C to 70°C

3 mV

TLV2221CDBV

VADC

TLV2221Y

−40

°C to 85°C

3 mV

TLV2221IDBV

VADI

TLV2221Y

† The DBV package available in tape and reel only.

‡ Chip forms are tested at TA = 25°C only.

TLV2221Y chip information

This chip, when properly assembled, displays characteristics similar to the TLV2221C. Thermal compression

or ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with

conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 10 MILS TYPICAL

BONDING PADS: 4

× 4 MILS MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

PIN (2) IS INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

+

−

OUT

IN +

IN −

VDD +

(5)

(1)

(3)

(4)

(2)

VDD −/ GND

40

(3)

(2)

(1)

(5)

(4)

32