ExampleBoardLayout

StencilOpenings

BasedonStencilThickness

of0,127mm(.005in)

TLV712xx

www.ti.com

SBVS150A – SEPTEMBER 2010 – REVISED JANUARY 2011

(1)

All linear dimensions are in millimeters.

(2)

Customers should place a note on the circuit board fabrication drawing not to alter the center solder mask defined

pad.

(3)

Publication IPC-7351 is recommended for alternate designs.

(4)

Laser-cutting apertures with trapedzoidal walls and also rounding corners will offer better paste release. Customers

should contact their board assembly site for stencil design recommendations. Example stencil design based on a 50%

volumetric load solder paste. Refer to IPC-7525 for other stencil recommendations.

Figure 23. Recommended Land Pattern for DBV Package

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