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TLV70233DBVR.B 数据表(PDF) 2 Page - Texas Instruments |
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TLV70233DBVR.B 数据表(HTML) 2 Page - Texas Instruments |
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2 / 37 page ![]() 2 TLV702 SLVSAG6D – SEPTEMBER 2010 – REVISED JULY 2019 www.ti.com Product Folder Links: TLV702 Submit Documentation Feedback Copyright © 2010–2019, Texas Instruments Incorporated Table of Contents 1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Pin Configuration and Functions ......................... 3 6 Specifications......................................................... 4 6.1 Absolute Maximum Ratings ...................................... 4 6.2 ESD Ratings ............................................................ 4 6.3 Recommended Operating Conditions ....................... 4 6.4 Thermal Information .................................................. 4 6.5 Electrical Characteristics........................................... 5 6.6 Typical Characteristics .............................................. 6 7 Detailed Description ............................................ 10 7.1 Overview ................................................................. 10 7.2 Functional Block Diagrams ..................................... 10 7.3 Feature Description................................................. 11 7.4 Device Functional Modes........................................ 12 8 Application and Implementation ........................ 13 8.1 Application Information............................................ 13 8.2 Typical Application .................................................. 13 9 Power Supply Recommendations ...................... 15 9.1 Power Dissipation ................................................... 15 10 Layout................................................................... 15 10.1 Layout Guidelines ................................................. 15 10.2 Layout Examples................................................... 16 11 Device and Documentation Support ................. 17 11.1 Device Support .................................................... 17 11.2 Documentation Support ........................................ 17 11.3 Receiving Notification of Documentation Updates 17 11.4 Community Resources.......................................... 17 11.5 Trademarks ........................................................... 17 11.6 Electrostatic Discharge Caution ............................ 17 11.7 Glossary ................................................................ 18 12 Mechanical, Packaging, and Orderable Information ........................................................... 18 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (March 2015) to Revision D Page • Changed OUT pin number from 5 to 3 in WSON column of Pin Functions table .................................................................. 3 • Added footnote to maximum EN voltage specification .......................................................................................................... 4 • Added parameter names to Recommended Operating Conditions table............................................................................... 4 Changes from Revision B (February 2011) to Revision C Page • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ................................................................................................. 1 • Changed Pin Configuration and Functions section; updated table format ............................................................................ 3 • Deleted Ordering Information table ....................................................................................................................................... 3 • Changed "free-air temperature" to "junction temperature" in Absolute Maximum Ratings condition statement ................... 4 • Changed Thermal Information table; updated thermal resistance values for all packages .................................................. 4 • Deleted Dissipation Ratings table .......................................................................................................................................... 4 • Changed VDO dropout voltage test conditions; deleted IOUT = 50 mA and IOUT = 100 mA with VOUT = 2.8 V test parameters ............................................................................................................................................................................. 5 • Deleted EVM Dissipation Ratings table ............................................................................................................................... 16 Changes from Revision A (October 2010) to Revision B Page • Added SON-6 (DSE) package and related references to data sheet..................................................................................... 1 |
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