LNK4115D datasheet(19/22 Pages) POWERINT

19 / 22 page

Rev. F 05/18

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PI-7461-120914

D08A

SO-8 (D Package)

3.90 (0.154) BSC

Notes:

1. JEDEC reference: MS-012.

2. Package outline exclusive of mold flash and metal burr.

3. Package outline inclusive of plating thickness.

4. Datums A and B to be determined at datum plane H.

5. Controlling dimensions are in millimeters. Inch dimensions

are shown in parenthesis. Angles in degrees.

0.20 (0.008) C

6.00 (0.236) BSC

4.90 (0.193) BSC

0.10 (0.004) C

A-B

1.27 (0.050) BSC

8X 0.31 - 0.51 (0.012 - 0.020)

0.25 (0.010) M C A-B D

0.25 (0.010)

0.10 (0.004)

(0.049 - 0.065)

1.25 - 1.65

1.75 (0.069)

1.35 (0.053)

0.10 (0.004) C

1.27 (0.050)

0.40 (0.016)

GAUGE

PLANE

0 - 8

1.04 (0.041) REF

0.25 (0.010)

BSC

SEATING

PLANE

0.25 (0.010)

0.17 (0.007)

DETAIL A

SEATING PLANE

Pin 1 ID

5.45 (0.215)

1.27 (0.050)

0.60 (0.024)

1.45 (0.057)

Reference

Solder Pad

Dimensions

4.00 (0.157)

TOP VIEW

SIDE VIEW

END VIEW

PCB FOOT PRINT

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