JA

R

A

MAX

J

T

MAX

D

P

)

(

)

(

Q

=

−

TPS61000, TPS61001, TPS61002, TPS61003

TPS61004, TPS61005, TPS61006, TPS61007

www.ti.com

SLVS279D – MARCH 2000 – REVISED AUGUST 2015

12.3 Thermal Considerations

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires

special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added

heat sinks and convection surfaces, and the presence of other heat-generating components affect the power

dissipation limits of a given component.

Three basic approaches for enhancing thermal performance are listed below:

•

Improving the power dissipation capability of the PWB design

•

Improving the thermal coupling of the component to the PWB

•

Introducing airflow in the system

The maximum junction temperature (TJ) of the TPS6100x devices is 125°C. The thermal resistance of the 10-pin

MSOP package (DGS) is RθJA = 161°C/W. Specified regulator operation is assured to a maximum ambient

temperature (TA) of 85°C. Therefore, the maximum power dissipation is about 248 mW. More power can be

dissipated if the maximum ambient temperature of the application is lower.

(8)

Under normal operating conditions, the sum of all losses generated inside the converter IC is less than 50 mW,

which is well below the maximum allowed power dissipation of 248 mW as calculated in Equation 8. Therefore,

power dissipation is given no special attention.

Table 6 shows where the losses inside the converter are generated.

Table 6. Losses Inside the Converter

LOSSES

AMOUNTS

Conduction losses in the switch

36 mW

Switching losses

8 mW

Gate drive losses

2.3 mW

Quiescent current losses

< 1 mW

TOTAL

< 50 mW

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